What are the precautions for the direction and shape of PCB pad printed wires

The SMT patch reflow soldering process requires that the pads of the two end Chip components should be independent pads. When the pad is connected to a large-area ground wire, the cross-laying method and the 45° grounding method should be preferred; the length of the wire drawn from the large-area ground wire or power line is greater than 0.5mm and the width is less than 0.4mm; with rectangular soldering The wire connected to the pad should be led out from the center of the long side of the pad to avoid a certain angle.

The SMT patch reflow soldering process requires that the pads of the two end Chip components should be independent pads. When the pad is connected to a large-area ground wire, the cross-laying method and the 45° grounding method should be preferred; the length of the wire drawn from the large-area ground wire or power line is greater than 0.5mm and the width is less than 0.4mm; with rectangular soldering The wire connected to the pad should be led out from the center of the long side of the pad to avoid a certain angle.

The wire between the SMD pads and the pad lead wire are shown in the figure. The figure is a schematic diagram of the connection between the pad and the printed wire.

What are the precautions for the direction and shape of PCB pad printed wires

Trend and shape of printed wire

(1) The printed wires of the circuit board in SMT should be very short. Therefore, if you can go the shortest, don’t go for the complicated ones. Follow the rules, do not multiply, and don’t make them as short as possible. It is of great help to the quality control of PCB circuit boards in the later stage.

(2) The direction of the printed wire must not have sharp bends and sharp angles, and the angle of the printed wire must not be less than 90°. This is because it is difficult to corrode the smaller inner corners when making the board. At too sharp outer corners, the copper foil can easily peel off or warp. The best form of turning is a gentle transition, that is, the inner and outer corners of the corner are the best arcs.

(3) When the wires pass between the two spacers but are not connected to them, the maximum and equal distance should be maintained with them; similarly, the distance between the wires should be uniform and equal, and the maximum should be maintained.

(4) When connecting wires between PCB pads, when the center distance between the pads is less than the outer diameter D of the pad, the width of the wire can be the same as the diameter of the pad; when the center distance between the pads When it is greater than D, the width of the wire should be reduced. When there are more than 3 pads on the pad, the distance between the wires should be greater than 2D.

(5) Copper foil should be reserved for ordinary grounding wire as much as possible.

(6) In order to increase the peel strength of the liner, a production line without conductive effect can be provided.

The Links:   MDS200-16 7MBR100VX120-50

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