The interconnect density of multi-chip packages has increased tenfold. How about Intel’s technical strength?

Recently, according to a foreign media VideoCardz report, Intel published an article today, announcing three new technologies that break through Moore’s Law. The goal of these technologies is to enable chip technology to continue to develop after 2025.

The interconnect density of multi-chip packages has increased tenfold. How about Intel’s technical strength?

According to public information, at the 2021 IEEE International Electronic Equipment Conference, Intel announced a 10-fold increase in the interconnect density of multi-chip hybrid packages, a 30%-50% increase in transistor density, new power and memory technologies, and quantum computing chip technologies, etc. .

Intel explained some of the innovative technologies that have been announced so far, including Hi-K metal gates, FinFET transistors, RibbonFETs, and so on. In the roadmap, Intel also showed a variety of chip processes, including the Intel 20A process, which further reduced the volume of logic gates, called Gate All Around.

Bud experts said that as of the latest, Intel and its affiliates have more than 270,000 patent applications in 126 countries/regions, of which about 11,602 patents are directly related to chips. As for directly related chip patents, from the perspective of patent trends, Intel’s patent applications were relatively stable from 2002 to 2010, but there was a small explosion in Intel’s chip patent applications in 2011.

In terms of Ribbon directly related patent technology, Intel has 51 sets of directly related patent applications in the above-mentioned fields. Intel’s patent applications in the above-mentioned fields are very scattered. In recent years, there are less than 10 patent applications. The technologies in this field are mainly Transistor and semiconductor related.

The Links:   SP14Q002-A1 LMS700KF21

Related Posts

Leave a Reply

Your email address will not be published. Required fields are marked *