“Last week, Fanlin Group released a new member of the Syndion G series-the new Syndion GP. In this week’s WeChat, Evan Patton, Vice President of Reliant System Products, Customer Support Division of Panlin Group, will tell you about the development background of the product.
Author: Fanlin Group
Last week, Fanlin Group released a new member of the Syndion G series-the new Syndion GP. In this week’s WeChat, Evan Patton, Vice President of Reliant System Products, Customer Support Division of Panlin Group, will tell you about the development background of the product.
Recently, the logic chips and memory chips used in smartphones, laptops, game consoles, and other devices that we like to use may be occupying a lot of news headlines. There are other semiconductors, although they are not well-known to the public, they are also not. Everywhere. Power devices used to control or convert electricity are a good example. Nowadays, power devices play a vital role in our increasingly digital world, supporting everything from mobile devices, home appliances such as air conditioners and rice cookers to electric cars and high-speed trains, and their applications are still growing rapidly.
As these applications continue to expand, their functions must also be improved to support higher voltages, faster switching and higher efficiency. For chip manufacturers, advanced power devices are accelerating the realization of more precise manufacturing processes, such as high aspect ratio etching.
In the past, power devices usually operated between tens of volts to hundreds of volts; now they need to operate in a higher voltage environment-up to or even more than 1,000 volts.
Now, these power devices need to increase the power capacity and improve the switching performance without sacrificing the form factor. This can be solved by using a trench with a higher aspect ratio. For this reason, chip manufacturers need extremely precise and uniform deep silicon etching processes to create these trenches that are critical to achieving device performance. The aspect ratio of these deep trenches can reach 60:1 or even higher, and requires excellent etching uniformity and profile. We might as well compare it like this: the aspect ratio of Burj Khalifa, one of the tallest buildings in the world, is about 9:1, which is only 1/6 of the aspect ratio of deep silicon trenches in future special technologies.
The precision manufacturing of these devices is not easy. Fanlin Group is in a leading position in the etching field and has been developing the equipment required for this important application and other applications. The new Syndion GP is based on our production-proven 200mm DSiE™ for deep silicon etching and leading 300mm Syndion products.
Syndion GP provides a 200mm to 300mm bridging solution for a range of applications of power devices and other devices, including depth, critical dimension uniformity and contour control, allowing chip manufacturers to achieve future device requirements.