NXP launches second-generation RF multi-chip modules with improved frequency, power and efficiency, maintaining a leading position in 5G infrastructure

Eindhoven, the Netherlands-December 3, 2020-NXP Semiconductors (NXP Semiconductors NV, NASDAQ: NXPI) today announced the launch of the second generation Airfast RF power multi-chip module (MCM), which was designed for It is to meet the evolution requirements of 5G mMIMO active antenna systems for cellular base stations. The focus of the new all-in-one power amplifier module series is to accelerate the coverage of 5G networks. It is based on NXP’s latest LDMOS technology to provide higher output power, wider frequency range and higher efficiency. The first generation of MCM products are the same.

The new AFSC5G26E38 Airfast module is a model for providing higher performance in the second-generation MCM series. Compared with the previous generation of products, the output power of the device has been increased by 20%, thereby meeting the needs of each base station tower to provide wider 5G coverage without increasing the size of the radio device. It also provides 45% power increase efficiency, which is 4 points higher than the previous generation product, thereby reducing the overall power consumption of the 5G network. The new AFSC5G40E38 takes full advantage of the performance of NXP’s latest generation LDMOS technology at high frequencies and can work in the 5G C-band from 3.7 to 4.0 GHz. It was recently selected by Rakuten Mobile in Japan.

Paul Hart, Executive Vice President and General Manager of the RF Power Business Unit of NXP, said: “NXP’s latest multi-chip modules have greatly improved efficiency, thanks to the latest enhancements to LDMOS and the increase in integration. We strive to improve integration. Integrating more functions into each module means that customers only need to purchase, assemble and test fewer components. Therefore, our products can provide higher power and adopt a more cost-effective and compact design. This can speed up the time to market for customers and network mobile operators and help them meet the demand for 5G expansion.”

Comprehensive multi-chip module product portfolio for 5G expansion

NXP’s RF power multi-chip modules include LDMOS ICs, combined with integrated Doherty splitters and combiners, for 50 ohm input/output matching. This high level of integration eliminates the complexity of radio frequency, avoids multiple prototypes, and reduces the number of components to help increase production and shorten the certification cycle time. The second-generation product completes the first-generation series released last year, increasing the frequency and power level. Both generations of products have the same pin output format, allowing RF designers to quickly upgrade from one design to another, thereby reducing overall development time.

The second-generation Airfast MCM includes 10 new devices, covering the 5G frequency band from 2.3 to 4.0 GHz, with an average output power of 37 to 39 dBm. These devices are now certified, and NXP’s new RF power reference circuit digital library RF circuit collection will support them.

NXP 5G Access Edge Technology Product Portfolio

From antennas to processors, NXP provides a strong technology product portfolio to support 5G access edge technology to provide first-class performance and security for infrastructure, industrial and automotive applications. Including NXP’s Airfast RF power solution series, and the Layerscape series of programmable baseband processors, suitable for wireless data links, fixed wireless access and small base station equipment.

The Links:   LM64P101 SKM400GB176D

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