September 17, 2021-Mouser Electronics today released the fifth issue of the Empowering Innovation Together™ program in the 2021 series. Through selected blogs, infographics, videos, etc., let everyone update In-depth understanding of the development trend of intelligent transportation systems. This series also launched a new issue of the “Technology Between You and Me” podcast.
In the new issue of the podcast, Mouser’s technical content director Raymond Yin (Raymond Yin) and 5G Automobile Association’s Chief Technology Officer Dr. Maxime Flament discussed the rise of industry safety standards, Realizing the potential of 5G networks in transportation systems and the impact of edge computing on the automotive industry. The podcast can also be listened to on Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora, Spotify.
Ms. Tian Jiping, Vice President of Market and Business Development of Mouser Electronics Asia Pacific, said: “We see the rapid growth of global demand for safe and reliable intelligent transportation systems. With 5G, ultra-wide bandgap, next-generation wireless connectivity and other technologies We are entering the era of intelligent transportation solutions, which will completely change the entire industry and affect our communities, cities, and travel.”
The 2021 EIT series contains four short videos called “Past, Present, and Future”, as well as articles, blogs, infographics and other content, as well as technical dialogues between Mouser experts and other industry leaders. Following the intelligent transportation solutions, future scientific and technological topics will explore new product technologies such as radio frequency and wireless. The Empowering Innovation Together? program will showcase the development of a variety of new products and introduce the technological developments needed to keep up with the new trends in the market.
The fifth phase of the 2021 EIT program is co-sponsored by Mouser’s key partners Amphenol ICC, Amphenol RF, Digi International, Intel®, KEMET, Microchip Technology, Molex, STMicroelectronics, TDK and TE Connectivity.
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