Molex Technical Capability Flexible Printed Circuit Electromechanical Design

The design potential of flexible printed circuit (FPC) makes it an effective solution for applications in the automotive and medical fields. By using a variety of different materials and construction methods to conduct research and experiments, Molex engineers have overcome these circuit design challenges. In this way, Molex not only regards FPC technology as a practical choice, but also as the preferred solution.

The design potential of flexible printed circuit (FPC) makes it an effective solution for applications in the automotive and medical fields. By using a variety of different materials and construction methods to conduct research and experiments, Molex engineers have overcome these circuit design challenges. In this way, Molex not only regards FPC technology as a practical choice, but also as the preferred solution.

Generally speaking, this technology is only suitable for some applications that need to adjust the process to meet the limitations of the FPC design. The limitations include how much the circuit can be bent, and the frequency of the bending. In order to overcome these constraints and meet the requirements of mechanical and electrical applications, Molex engineers have explored various process methods and considered countless materials. In this way, Molex FPC can well withstand the environment such as spraying, chemical contact and washing. This is achieved through extensive research and experiments in the following key areas:

· material selection
・ Design layout
・ Signal Integrity (SI)
・ Mechanical resilience and reliability

Molex Technical Capability Flexible Printed Circuit Electromechanical Design

Molex engineers use a variety of tools to enhance the design process. The following highlights three of these tools.

1 Impedance calculator (special tool)

Impedance calculator is one of the most important tools used by Molex to optimize circuit design. This tool was developed more than 20 years ago. It can analyze impedance C using complete shielding planes and cross-parallel shielding planes on multiple dielectric layers at the same time. At the same time, many other important electrical parameters can be calculated. The impedance calculator has always been a widely used tool in many Molex applications.

2 Ansoft HFSS

This software allows Molex engineers to analyze various SI parameters such as insertion loss, return loss, NEXT and FEXT through 3D modeling. Ansoft HFSS essentially allows engineers to verify the entire design before prototyping.

3 Bending radius calculator

Molex does not rely on estimates taken from the total thickness and number of layers, but uses calculations based on the elongation properties of the material. For example, by analyzing each material and its properties in the stack, Molex engineers can quantify the bending radius of each circuit layer. In this way, Molex can produce reliable circuit products by calculating the bending radius instead of estimating based on empirical rules.

A full understanding and good application of various mature and well-tested mechanical and electrical principles can lay a solid foundation for highly successful FPC projects. Molex combines entrepreneurial thinking with years of rich experience and constant pursuit of technological change. The method that Molex adopts for each customer’s project is simple: instead of letting the application supplement the FPC, the FPC should supplement the application.

As an authorized distributor of Molex, Heilind can provide relevant services and support for the market. In addition, Heilind also supplies products from many top manufacturers in the world, covering 25 different component categories, and attaches importance to all market segments and all customers. Constantly seek a wide range of product supplies to cover all markets.

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