At the beginning of 2020, a sudden outbreak of new coronary pneumonia plunged the global economy into a crisis, and the development of the semiconductor field has naturally attracted great attention from the industry.
In foreign countries, affected by the epidemic, in addition to layoffs by some semiconductor manufacturers, some countries have also taken measures to lock down the country. For example, Malaysia announced the country lock plan on March 17, and Singapore and Japan, two major memory product production centers, also announced the closure. city plan.
As for the domestic side, since the outbreak of the new crown epidemic, the state and local governments have taken a series of measures to curb the continued spread of the epidemic. At present, the domestic epidemic is gradually easing, and Chinese semiconductor companies have basically withstood the impact of the epidemic. The huge test of the STAR Market, the listing on the Science and Technology Innovation Board, corporate investment, online signing, and project start-up are still proceeding in an orderly manner…
The following is Global Semiconductor Watch’s inventory of semiconductor industry events in the first half of 2020 (Note: The following rankings are in no particular order)
Sci-tech innovation board adds more semiconductor companies
Since the establishment of the Science and Technology Innovation Board, it has been favored by many semiconductor companies. Since 2020, the team on the Science and Technology Innovation Board has continued to grow. Not only many semiconductor companies have announced their entry into the Science and Technology Innovation Board, but some companies have officially listed on the Science and Technology Innovation Board.
Among them, SMIC has received the most attention in the industry. It is reported that SMIC only took 37 days from the acceptance of the IPO on June 1 to the completion of the issuance, setting a record for the fastest issuance on the Science and Technology Innovation Board. On July 7, SMIC ushered in the subscription of the Science and Technology Innovation Board.
SMIC announced that the probability of winning the lottery for its online subscription on the Science and Technology Innovation Board is 0.21%. The average lottery probability of the 119 listed companies on the Science and Technology Innovation Board is 0.0485%, compared with SMIC’s probability is much higher than the average. , ranked second, only 0.23% lower than CRSC.
In addition to SMIC, semiconductor companies that have entered the Science and Technology Innovation Board since 2020 include Shanghai Hejing, Gekewei, Cambrian, Shanghai Silicon Industry, VeriSilicon, Hengxuan Technology, Fudan Microelectronics, Shengmei Semiconductor , Ruixin Micro, Blue Arrow Electronics, Microconductive Nano, Lihe Science and Technology, Yinhe Microelectronics, Huahai Qingke, Xinqi Microelectronics, Zhongke Jingshang, Tianke Heda, Core Vision, Lihewei, Thinking Ruipu, Liyang Chip, China Micro Corporation, Shengong Co., Ltd., Huafeng Measurement and Control, etc.
Hubble Technology invests in several semiconductor companies
According to the industrial and commercial information of Global Semiconductor Watch, as of June 2020, Hubble Technology has invested in 12 companies, of which 6 have invested since 2020, namely Qinghong Electronics (32.14%), Xingang Coast (8.57%), Changzhou Fullene (10%), Haoda Electronics (5.66%), Zonghui Xinguang (5.54%), Canqin Technology (4.58%).
According to the data, Hubble Technology was established in April 2019 with a registered capital of 1.7 billion yuan and is 100% controlled by Huawei Investment Holding Co., Ltd. Since its establishment, Hubble Technology has invested in 13 foreign companies. In addition to the above 6 companies, it also includes Kunyou Optoelectronics (5.74%), Yutai Microelectronics (10%), Shandong Tianyue (8.37%), Siripu Microelectronics (8%), Jiehuat Microelectronics (5.4%), Beijing Shensi (3.67%), and Dongwei Semiconductor, etc.
At present, the companies invested by Hubble Technology have covered many fields such as third-generation semiconductors, wafer-level optical chips, power management chips, clock chips, radio frequency filters, and artificial intelligence.
YMTC pushes 128-layer 3D NAND
On April 13, YMTC officially released two 128-layer 3D NAND flash memory, namely 128-layer QLC 3D NAND flash memory (model: X2-6070) and 128-layer 512Gb TLC (3 bit/cell) flash memory chip (model: X2) -9060).
Among them, the X2-6070 product has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among the known models in the industry. With 1.6Gb/s high-speed read and write performance and 1.33Tb high capacity, YMTC once again proved the forward-looking and maturity of the Xtacking architecture to the industry through the X2-6070, and explored a feasible path for the future development of the 3D NAND industry.
According to a survey by DRAMeXchange, a Chinese NAND Flash manufacturer, YMTC, a Chinese NAND Flash manufacturer, has delivered 128-layer 3D NAND samples to storage controller manufacturers in the first quarter. It is intended to be used in various terminal products such as UFS and SSD, and will be shipped to module factories at the same time.
At present, only Samsung and SK Hynix have launched 128-layer products, while the 112/128/144-layer products of Kioxia/Western Digital, Micron, and Intel will not be released in volume until the second half of the year, which will be beneficial to the 128 of YMTC. Layer products are catching up. According to TrendForce’s estimates, in 2021, YMTC’s storage capacity will account for about 8% of the total NAND Flash.
The second phase of the Yangtze River storage project started
On June 20, the second phase (civil construction) of the National Memory Base Project implemented by Changjiang Storage started in Wuhan East Lake High-tech Zone.
According to Hubei Daily, the Yangtze Memory National Memory Base Project is jointly invested and constructed by Tsinghua Unigroup, National Integrated Circuit Fund, Hubei Science and Technology Investment Group and Hubei Integrated Circuit Fund, with a total investment of US$24 billion. It is planned to build 3D NAND flash memory chips in two phases. factory.
The first phase of the project started construction at the end of 2016, mainly achieving technological breakthroughs and building a production capacity of 100,000 pieces per month. The current progress is smooth. The 32-layer and 64-layer memory chip products have achieved stable mass production, and the world’s first 128-layer memory chip has been successfully developed. QLC three-dimensional flash memory chip; the planned production capacity of the second phase is 200,000 pieces/month, and the monthly production capacity of the two-phase project will total 300,000 pieces.
Toshiba shutdown, affecting 76,000 people
In response to the epidemic, Toshiba announced on April 15 that from April 20 to May 6, operations including business locations and even factories will be completely shut down, affecting as many as 76,000 employees.
According to TrendForce, Toshiba’s NAND (flash memory) division has become independent as Kioxia on October 1 last year, and has nothing to do with Toshiba’s announcement of the shutdown. Therefore, Kioxia is maintaining normal operation, and the factory has not The occurrence of related matters such as shutdown will naturally not affect the production of NAND products.
Previous research by TrendForce pointed out that in 2020, the average monthly production capacity of Kioxia will be about 500K, accounting for more than 30% of the total production capacity of NAND Flash.
Kioxia Fab6 and K1 factories shut down for inspection
In the first half of 2020, Kioxia’s Fab6 factory in Yokkaichi, Mie Prefecture, Japan, and the K1 Fab factory in Kitakami, Iwate Prefecture, were shut down for inspection.
Among them, the shutdown of the Fab6 factory was mainly due to a fire alarm, while the shutdown of the K1 Fab factory was due to an earthquake.
At 6:10 am on January 7, 2020, a fire broke out in the internal equipment of Kioxia’s Fab6 factory in Yokkaichi, Mie Prefecture, Japan. According to relevant market sources, when the fire broke out, Kioxia immediately evacuated all operators in the area, and simultaneously invited relevant factory personnel and local fire departments to dispatch disaster relief, and no casualties were caused.
It is reported that Fab 6, jointly invested by Kioxia and Western Digital, was officially opened in September 2018, and mainly produces 64-layer and 96-layer 3D NAND that are currently mainstream.
At 5:30 a.m. on April 20, a strong earthquake of magnitude 6.1 occurred off the coast of Miyagi Prefecture, Japan. According to the report of the Japan Meteorological Agency, the earthquake in Kitakami, Iwate Prefecture, where the new K1 Fab factory of Kioxia is located, reached a magnitude of 3. The K1 Fab was subsequently shut down for Check.
According to TrendForce’s survey, whether it was the shutdown caused by the fire or the earthquake, it did not have much impact on the supply chain supply and the price in the spot market.
Samsung Hwaseong plant catches fire
On the evening of March 8, there was a fire in the Samsung Huacheng factory. As we all know, Samsung is the world’s largest NAND Flash manufacturer, so after the fire, it was highly concerned by the industry.
However, according to an investigation by TrendForce, a global market research organization, the fire area was the wastewater treatment building adjacent to Line 16, which did not directly affect the production area, and the fire occurred in the cooling tower on the top floor and did not damage the building. equipment, and there are several sets of similar equipment in the factory, Samsung can support it with other facilities, so there is no impact on Line 16 production.
It is reported that Line 16 is mainly a factory for the production of 3D flash memory (3D NAND Flash) and CMOS image sensors (CIS/CMOS Image Sensor). 11-12% of the total film production, and plans to reduce flash memory (NAND) capacity quarter by quarter, the factory will gradually be converted to CIS production.
Qualcomm returns to the top of IC design companies
According to the latest statistics from the Top 10 Industry Research Institute, a subsidiary of TrendForce, the world’s top ten IC design companies’ revenue and rankings in the first quarter of 2020 were released. The demand for teaching has grown significantly, and revenue has shrugged off the trend of six consecutive quarters of decline.
Yao Jiayang, an analyst at Topology Industry Research Institute, said that Qualcomm successfully entered the supply chain of flagship and high-end models of many mainland mobile phone brands in the first quarter. Netcom’s product demand has brought Qualcomm’s revenue back to growth.
According to the data, in the first quarter of 2020, Qualcomm achieved a total revenue of US$4.1 billion, a year-on-year increase of 10.2%. The second-ranked Broadcom semiconductor division, due to the impact of market competition and Sino-US trade friction, reported five consecutive years of revenue. Quarterly negative growth, revenue was US$4.082 billion, down 2.4% year-on-year, while NVIDIA’s growth momentum in game graphics cards and data centers was quite strong, with revenue in the first quarter increasing by 39.6% year-on-year.
BYD Semiconductor introduces war investment
In the first half of 2020, BYD Semiconductor has increased capital and shares to introduce strategic investment twice, with a total capital increase of 4.9 billion yuan and a total of 44 strategic investors, including South Korea’s SK Group, Xiaomi Group, China Merchants Bank International, Lenovo Group, Strategic investors such as CITIC Industrial Fund, Houan Fund, SMIC Juyuan, SAIC Production Investment, BAIC Production Investment, Shenzhen Huaqiang, Blue Ocean Huateng, and INVT.
According to the data, BYD Semiconductor, formerly known as Shenzhen BYD Microelectronics Co., Ltd., completed its name change and reorganization in April this year. After the reorganization, BYD Semiconductor’s main business covers the R&D, production and sales of power semiconductors, intelligent control ICs, intelligent sensors and optoelectronic semiconductors, and has an integrated operation of the entire industry including chip design, wafer manufacturing, packaging and testing, and downstream applications. chain.
It is reported that BYD Semiconductor is actively seeking an appropriate opportunity to go public independently. At present, BYD Semiconductor has completed internal restructuring, equity incentives, and the introduction of strategic investors. BYD said that the follow-up company will accelerate the spin-off and listing of BYD Semiconductor, and start to cultivate more market-competitive subsidiaries to achieve market-oriented operations and continuously increase the company’s overall price.
The second phase of the big fund increases the capital of Ziguang Zhanrui
On May 11, Ziguang Zhanrui’s equity reorganization project was completed, and the 5 billion yuan capital increase has been credited. In the future, Ziguang Zhanrui will take Ziguang Zhanrui (Shanghai) Technology Co., Ltd. as the main body of the listing. The report pointed out that this new round of financing was completed by three institutions, the National Integrated Circuit Industry Investment Fund Phase II, Shanghai Integrated Circuit Industry Investment Fund, and Zhuji Famous Quanying Investment Management Partnership. 100 million yuan, 500 million yuan, a total of 5 billion yuan.
In addition, according to the National Credit Information Publicity System, the industrial and commercial information of Ziguang Zhanrui was changed on June 2, and the registered capital was increased from RMB 4.2 billion to RMB 4.62 billion. Phase II and others are new shareholders. At present, Spreadtrum Investment is still the largest shareholder of Unisplendour Zhanrui, with a shareholding ratio of 38.55%; the first and second phases of the National Fund hold 15.28% and 4.09% of the shares of Unisplendour Zhanrui respectively.
In May 2019, Ziguang Zhanrui announced that it has started preparations for listing on the Science and Technology Innovation Board, and plans to complete the PreIPO round of financing and overall restructuring in 2019. According to a recent report by the Science and Technology Innovation Board Daily, the IPO process of Ziguang Zhanrui is still steady. In progress, “Everything is going well at present. It will be held at the IPO on the Science and Technology Innovation Board at the end of 2020.”
ASML lithography project signed with Wuxi
On May 14, Jiangsu Wuxi High-tech Zone and ASML signed a strategic cooperation agreement to expand and upgrade the lithography equipment technical service (Wuxi) base.
Wuxi Daily pointed out that the lithography equipment technical service (Wuxi) base covers two major business sectors: a technology center engaged in high-tech and high-value-added services such as lithography machine maintenance and upgrade, as well as providing customers with efficient supply chain services, equipment installation, A semiconductor supply chain service center that provides higher-level logistics support for materials required for upgrades and production operations.
It is reported that ASML is one of the world’s largest semiconductor equipment manufacturers and one of the world’s most advanced lithography equipment manufacturers. The signing of the project in Wuxi will further improve Wuxi’s service capabilities, better meet the development needs of the local integrated circuit industry, and help customers reduce manufacturing costs while continuously improving the value of chips.
Apple confirms it will ditch Intel chips
At the end of June, Apple officially released its self-developed ARM-based Mac processor (hereinafter referred to as Mac SoC), announcing that Mac is expected to gradually introduce Apple Silicon (generally referred to as Apple’s self-developed chips) this year. According to a survey by the Semiconductor Research Office of TrendForce, Apple’s first Mac SoC will be produced using TSMC’s 5nm process.
TrendForce pointed out that TSMC currently only has the A14 Bionic SoC planned to be used in the new iPhone 12 in 2020 for mass production on its 5nm process, and the A14X Bionic SoC planned to be equipped with the new iPad in 2021 will start small production in the third quarter. , and Mac SoC is expected to start production in the first half of 2021, so Mac products that actually use Apple Silicon’s latest series of processors are expected to come out in the second half of next year.
In addition, TrendForce also stated that in 2021, Intel’s product planning is still on the 10nm process. As Apple Silicon enters the 5nm process generation, under the influence of process shrinkage, the number of transistors that can be integrated with the same chip size will increase significantly, and the efficiency and Power saving performance will have the opportunity to compete with Intel mainstream processors.
Intel reinvests in two Chinese semiconductor companies
On May 12, local time, Intel announced that its venture capital firm, Intel Capital, invested US$132 million in 11 start-up companies, including two Chinese semiconductor companies, General Electronics and Perma Pure Materials.
According to the data, Gelun Electronics is a design automation (EDA) software provider, providing advanced device modeling and fast circuit simulation solutions, and is committed to improving the competitiveness of high-end integrated circuit design under advanced semiconductor technology, providing world-leading, Innovative integrated circuit design solutions.
Perma Pure Materials is a supplier of high-purity specialty gases and materials for semiconductor manufacturing plants. It has one of the largest germane production bases located in Quanzhou, Fujian. The base produces and operates ultra-high-purity Electronic special gases, various Mixed gas and other electronic grade materials are widely used in integrated circuits, liquid crystal panels, LEDs, solar cells and related electronic manufacturing industries.
It is reported that in addition to the two newly invested companies, Intel has previously invested in a number of Chinese semiconductor companies, including many listed companies on the Science and Technology Innovation Board, such as Montage Technology and Espressif Technology.
TSMC to build 12-inch fab in US
On May 15, TSMC announced that it will build a new 12-inch advanced fab in Arizona, USA.
According to reports, the fab will use TSMC’s 5nm process technology to produce semiconductor chips, with a planned monthly production capacity of 20,000 wafers, which will directly create more than 1,600 high-tech professional job opportunities and indirectly create thousands of semiconductor industry ecosystems. job opportunity. The fab will start construction in 2021 and start mass production in 2024. From 2021 to 2029, TSMC will spend about $12 billion on this project, including capital expenditures.
As the world’s largest foundry, TSMC currently has 12 fabs including 6-inch, 8-inch and 12-inch fabs, of which the 12-inch capacity is about 800K per month. The only 8-inch wafer fab in Camas, Washington, located in the United States, has a monthly production capacity of 40K, accounting for only 1-2% of the overall production capacity.
Regarding the fact that TSMC will build a factory in the United States, TrendForce pointed out that although TSMC already has an 8-inch factory located in the United States, the supply chain of the 12-inch factory is different from that of the 8-inch factory. Therefore, in addition to TSMC, other semiconductor raw material manufacturers even The surrounding component factories will not rule out going to the United States together. In the long run, the possibility of localized production of the semiconductor industry in the United States will increase.
The market value of Zhaoyi Innovation and NAURA exceeded 100 billion
Since 2020, two more companies with a market value of more than 100 billion yuan have been born in China’s semiconductor industry, namely Zhaoyi Innovation and North Huachuang.
GigaDevice is a well-known memory chip design company in China. According to TrendForce data from TrendForce, GigaDevice ranked among the top ten in China’s IC design industry in terms of revenue in 2018, up 13.5% from 2017.
It is reported that the main products of Zhaoyi Innovation are divided into flash memory chip products, microcontroller products and fingerprint sensor products newly added in 2019, which are widely used in handheld mobile terminals, consumer electronic products, personal computers and peripherals, networks, battery equipment, medical In the fields of equipment, office equipment, automotive electronics and industrial control equipment, customers include Apple, Huawei, OPPO and other global first-line brand customers.
North Huachuang is a leading enterprise of high-end integrated circuit process equipment in China. Its semiconductor equipment products include etching equipment, PVD equipment, CVD equipment, oxidation/diffusion equipment, cleaning equipment, new Display equipment, gas mass flow controllers, etc. Technological breakthroughs have been made in several key process areas, breaking the monopoly of foreign giants.
According to NAURA’s 2019 financial report, the company’s 12-inch silicon etching machine, metal PVD, vertical oxidation/annealing furnace, wet cleaning machine and other high-end semiconductor equipment have entered the mass production stage one after another, and 8-inch silicon etching Equipment such as machine, metal etching machine, deep groove etching machine, metal PVD, vertical oxidation/annealing furnace, wet cleaning machine, etc. have frequently received repeated purchase orders from customers.
In the field of wafer manufacturing, NAURA’s traditional advantageous equipment such as etching machines, furnace tubes and PVD have entered the supply chain of many domestic manufacturers such as Yangtze Memory, SMIC and Hua Hong.