On December 13th, Shenzhen Intang Intelligent Control Co., Ltd. (hereinafter referred to as “Intang Intelligent Control”) issued an announcement stating that the company has cooperated with Zhongtang Air Railway Industry Development Co., Ltd. (hereinafter referred to as “Zhongtang Development”), Shenzhen Yingmeng System Technology Co., Ltd. (hereinafter referred to as “Yinmeng Technology”) signed a cooperation agreement. The three parties plan to establish a project company Sichuan Intangxin Technology Co., Ltd. through a joint venture to invest in the construction of the “Intang semiconductor Industrial Park” project in Chengdu.
(From company announcement)
The announcement shows that the registered capital of the project company is tentatively set at 500 million yuan, of which the company or the subsidiary within the scope of the consolidated statement will contribute a total of 125 million yuan in equity and currency, and it is planned to hold 25% of the equity of the project company.
It is reported that the project company to be established, Sichuan Intangxin Technology Co., Ltd., is registered in Building 14, Zhongtang Air Railway Group, No. 2009, Xihanggang Avenue, Shuangliu District, Chengdu.The business scope includes the design, R&D, manufacturing and sales of integrated circuits; the distribution of Electronic components; the application of intelligent systems, etc.
The situation of shareholders and the method of capital contribution are as follows (unit: ten thousand yuan):
(From company announcement)
It is reported that the name of this foreign investment project is the “Yingtang Semiconductor Industrial Park” project, with a total investment of about 2.5 billion yuan. The project content is centered on the semiconductor industry and relies on national and local industrial policies. Starting with other product types, relying on the industry experience and technology and equipment accumulation taught by Party A, Party B, Party C and industry experts, we plan the industries from IC design, characteristic FOUNDRY production line, packaging, testing, and program development and application. An industrial park for the entire semiconductor industry chain will be formed.
According to the actual situation of planning and project operation, this project is divided into three parts of investment and construction:
The first part is planned to invest about 220 million yuan to build an optical packaging and testing production line with an annual output of 120 to 180 million units and an IPM packaging and testing production line with an annual output of 1.5 to 2 million units; it is expected to be completed and put into operation in October 2022 , To achieve production in September 2024; the second part of the planned investment is about 1.81 billion yuan to build a FAB 6-inch feature (including SiC) process line with an annual output of 720,000 pieces; it is expected to be completed and put into production in October 2023, and 1 Achieve production capacity by the month; the third part is to build an advanced packaging and testing production line with an annual production capacity of 2 billion pieces. After the first and second parts of the project are completed and put into production, the agreement will be made according to the situation.