FTDI launched an evaluation board to match its latest generation USB power transfer IC

July 29, 2021-In order to support the company’s expertise in creating advanced semiconductor technology for USB power transmission, FTDI Chip has now announced a new development solution. The hardware is based on the FT4233HP multi-channel interface IC.

The new FT4233HP high-speed USB serial/FIFO evaluation board will enable engineers to start implementing USB power delivery arrangements faster. This may be to transform this feature into a legacy design that is already in operation, or related to a new device they are prototyping.

The size of the circuit board is 138.5 mm x 77 mm, which contains a pair of C-type power transmission ports. The first of these ports can cover the roles of receiver (receiving power) and supply (providing power). The second port is only used as a receiver. Both ports can support 5V, 9V, 12V, 15V and 20V Power Delivery Object (PDO) profiles-as defined in the USB Power Delivery Specification Version 3.0. These configuration files can be configured by connecting an external EEPROM memory, and the LEDs indicate which PDO configuration file is being used.

Although the first port provides USB data transmission and power transmission, the second port only has the power transmission function. It also includes a power transfer function, and the input power on the second port is transferred to the first port. Through the onboard I2C interface and GPIO pins, external control of the power transmission strategy can be achieved. In this way, the voltage regulator and load switch can be adjusted.

The FT4233HP evaluation board will be available in the fourth quarter of 2021.

  About FTDI chip

FTDI Chip develops innovative silicon solutions to enhance interaction with the latest global technologies. The company’s main goal is “Bridge Technology” in order to provide engineers with a highly complex, feature-rich, powerful and easy-to-use product platform. These platforms can create Electronic designs with high performance, low peripheral component requirements, low power budget and minimal board space. FTDI Chip’s long and expanding Universal Serial Bus (USB) product line has recognized product brands such as ubiquitous R-Chip, X-Chip, Hi-Speed ​​and SuperSpeed ​​USB 3.0 series.

FTDI Chip is a fabless semiconductor company that cooperates with the world’s leading foundries. The headquarter is located in Glasgow, UK, with R&D facilities in Glasgow, Singapore and Taipei (Taiwan), and regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).

The Links:   G150XG01-V3 DMF-50174ZNF-FW-BDN

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