“The integrated circuit has always been one of the focuses of everyone’s attention. Therefore, in response to your points of interest, the editor will bring you related introductions to integrated circuit packaging. For details, please see below.
The integrated circuit has always been one of the focuses of everyone’s attention. Therefore, in response to your points of interest, the editor will bring you related introductions to integrated circuit packaging. For details, please see below.
Integrated circuits or microcircuits, microchips, and chips are a way of miniaturizing circuits (mainly including semiconductor devices, but also passive components, etc.) in electronics, and are usually manufactured in On the surface of the semiconductor wafer. Integrated circuits have the advantages of small size, light weight, few lead wires and soldering points, long life, high reliability, and good performance. At the same time, they have low cost and are convenient for mass production. In many modern industries, integrated circuits have almost become an indispensable existence.
At present, the integrated circuit industry no longer relies on the development of single devices such as CPU and memory. Mobile interconnection, triple play, multi-screen interaction, and smart terminals have brought multiple market spaces. The continuous innovation of business models has injected new vitality into the market. At present, my country’s integrated circuit industry has a certain foundation. Over the years, my country’s integrated circuit industry has gathered technological innovation vitality, market expansion capabilities, resource integration power and broad market potential, which will enable the industry to achieve rapid development and progress in the next 5 to 10 years. A new step laid the foundation. In order to improve everyone’s understanding of integrated circuits, the following editor will introduce the four main packaging forms of integrated circuits.
1. SOP small outline package
SOP began in the late 1970s, and there are two other names, DFP and SOL. In actual production, SOP is a commonly used component packaging form. In addition, SOP is also one of the surface mount packages, and from the perspective of the package shape, it is mainly L-shaped. Divided from packaging materials, SOP can be divided into two types, plastic SOP and ceramic SOP are divided into two types: plastic and ceramic.
In addition to being used for memory LSIs, the SOP package can also be used in other areas. For example, the input and output terminals do not exceed 10-40 fields. With the progress and demands of the times, SOP has gradually evolved into other forms, such as SSOP, SOIC and other packaging forms.
2. BGA ball grid array package
After talking about the SOP small outline package, let’s take a look at the BGA ball grid array package.
The PGA pin grid array has been improved to obtain a BGA package. The method of the BGA package form is to fill a certain surface with pins in a grid pattern, so that the Electronic signal can be transmitted from the integrated circuit to the printed circuit board during operation. After adopting the BGA package, the pins at the bottom of the package can be replaced by other forms, usually solder balls configured manually or through an automated machine that can be positioned by flux.
Compared with other package forms, such as four-side pin flat package, dual in-line package, etc., BGA package has two great advantages, one is that it can accommodate more pins, and the other is that it has a shorter average lead. Length, two advantages make BGA package can have higher speed performance.
3. PGA pin grid array package
After talking about BGA ball grid array packaging, let’s take a look at PGA pin grid array packaging.
The PGA pin grid array package is mainly used in the field of microprocessors. In this field, this package form can exert its maximum efficiency. The PGA pin grid array package is mainly to package the integrated circuit in the form of square pins at the bottom, and the integrated circuit can be conveniently soldered to the socket of the circuit board through the pins. It can be seen that the PGA pin grid array package is suitable for occasions with frequent insertion and removal. Compared with the dual in-line package, the advantage of the PGA pin grid array package is that it can use a smaller area to complete the same work.
4. DIP dual in-line package
After talking about the PGA pin grid array package, let’s take a look at the DIP dual in-line package.
The so-called DIP dual in-line package refers to integrated circuit chips packaged in dual in-line format. Most small and medium-sized integrated circuit ICs use this type of package, and the number of pins generally does not exceed 100. The CPU chip in DIP package has two rows of pins, which need to be inserted into the chip socket with DIP structure. The DIP packaged chip should be especially careful when plugging and unplugging from the chip socket to avoid damaging the pins.